Stellantis and Hon Hai Technology Group, also known as Foxconn, have signed a non-binding memorandum of understanding to create a partnership with the intent to design a family of purpose-built semiconductors to support Stellantis and third-party customers, the companies announced.
“Our software-defined transformation will be powered by great partners across industries and expertise,” said Carlos Tavares, Stellantis CEO. “With Foxconn, we aim to create four new families of chips that will cover over 80% of our semiconductor needs, helping to significantly modernize our components, reduce complexity, and simplify the supply chain. This will also boost our ability to innovate faster and build products and services at a rapid pace.”
“As a leading global technology company, Foxconn has the depth of experience in manufacturing semiconductors and software – two key components in the production of electric vehicles. We look forward to sharing this expertise with Stellantis and together tackle the long-term supply chain shortages, as we continue with the expansion into the electric vehicle market,” said Young Liu, Chairman & CEO of Foxconn Technology Group.
The collaboration will support Stellantis’ initiatives to reduce semiconductor complexity, design an all-new family of purpose-built semiconductors to support Stellantis vehicles and provide capabilities and flexibility in this area of growing importance as vehicles become increasingly software-defined, Stellantis representatives said.
The Foxconn semiconductors will be utilized within the Foxconn EV ecosystem as the company continues to extend its capabilities in electric vehicle manufacturing, the company said.